Infineon is playing a key role in BMW’s Neue Klasse software-defined vehicle platform, supplying semiconductors for central computing, high-speed in-vehicle networking, and intelligent power management. The new zonal E/E architecture enables hardware–software decoupling and SOTA updates, reflecting the industry shift toward centralized, high-compute vehicle electronics.
From a component perspective, the platform integrates:
- AURIX™ and TRAVEO™ MCUs for central and zonal control
- BRIGHTLANE™ automotive Ethernet for low-latency connectivity
- OPTIREG™ PMICs and PROFET™ eFuses for smart power distribution
The architecture reduces wiring by ~600 meters and vehicle weight by ~30%, while programmable power management improves energy efficiency by around 20%. This translates into higher semiconductor content per vehicle, particularly in functional-safety MCUs, power devices, and automotive networking ICs.
For the electronic components supply chain, SDV trends are driving:
- Rapid growth in high-performance automotive MCUs and domain controllers
- Increasing adoption of automotive Ethernet
- eFuse and smart high-side switches replacing traditional fuses
- Centralized and software-configurable power management
As E/E architectures move from distributed to centralized, semiconductor value per car continues to rise, favoring suppliers with automotive-grade portfolios and long-term supply capabilities.