Recently, due to the continued tight capacity of TSMC (Taiwan Semiconductor Manufacturing Company), Marvell and MediaTek are seriously evaluating the possibility of integrating Intel EMIB technology into their ASIC chip design architecture, a move that is attracting widespread attention in the industry.
EMIB (Embedded Multi-Chip Interconnect Bridge) technology allows for high-density, high-bandwidth connections between different chips within the same package, which is crucial for improving performance and optimizing complex system designs. For Marvell and MediaTek, successful implementation of EMIB would mean more flexible and efficient options when designing high-performance ASIC chips.
Analysts believe this shift also reflects the structural challenges currently facing the semiconductor industry: with tight foundry capacity, design companies are actively seeking alternative paths to bypass manufacturing bottlenecks while meeting increasing performance and cost demands.
Recent job postings from Apple, Qualcomm, and Broadcom all explicitly mention EMIB-related technical positions, demonstrating that leading companies are actively building talent reserves in the advanced packaging field.
In summary, Marvell and MediaTek's consideration of adopting Intel EMIB could not only enhance the competitiveness of their future product lines but also provide new design ideas for the entire chip industry—addressing the challenges of increasing downstream demand and technological complexity through packaging and interconnect technology innovation in the context of limited manufacturing capabilities.