
| Type | Description |
|---|---|
| Series: | 624 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | - |
| Fin Height: | 0.250" (6.35mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 25.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 2500 |
Current price of 624-25ABT3 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK 45X45X20MM L-TAB T412
HEATSINK 30X30X25MM L-TAB T412
HEATSINK 45X45X12.7MM XCUT
RES SMD 100 OHM 1% 1/2W 1913
HEATSINK FOR 21MM BGA
IC MCU 16BIT 128KB FLASH 80BGA
INSULATION DISPLACEMENT TERMINAL