
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-263 (D²Pak) |
| Attachment Method: | SMD Pad |
| Shape: | Rectangular, Fins |
| Length: | 0.763" (19.38mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | - |
| Fin Height: | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 23.00°C/W @ 300 LFM |
| Thermal Resistance @ Natural: | 11.00°C/W |
| Material: | Copper |
| Material Finish: | Tin |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 | ||
| 1000 | ||
| 5000 |
Current price of V-1102-SMD/A-L is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK 50X50X25MM XCUT T412
HEATSINK 40X40X10MM R-TAB T766
HEATSINK 50X50X12MM XCUT
PANEL IND 28V 1/2" DOM OR W/TERM
HEATSINK TO-263 19.38X25.40MM
IC MCU 32BIT 32KB FLASH 48TQFP
REDBOARD ATMEGA328 EVAL BRD