
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter: | - |
| Melting Point: | 281°F (138°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 1.76 oz (50g) |
| Shelf Life: | 12 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of TS391LT50 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SOLDER LEAD-FREE 0.8MM 100G
SAC 305 LEAD FREE SOLDER PASTE T
SOLDER FLUX-CORED/245 .031" 1LB
THERMALLY STABLE SOLDER PASTE NO
IC MCU 32BIT 512KB FLASH 64LQFP
IC MCU 32BIT 128KB FLASH 100BGA
CBL PLUG-OF-NAILS TO CORTEX SWD