
| Type | Description |
|---|---|
| Series: | - |
| Package: | Jar |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 17.64 oz (500g) |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of SMD291SNL500T5 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SOLDER FLUX-CORED/275 .0240" 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
SOLDER LEAD-FREE 0.5MM 100G
SOLDER PASTE SAC305 500G T5
IC PWR SWITCH 1:1 8SOIC
IC REG BUCK ADJ 2A SYNC TSOT23-8
MOD IPM 6PAC 600V 100A