
| Type | Description |
|---|---|
| Series: | Lo-PRO®file, 513 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 | ||
| 100 | ||
| 500 | ||
| 1000 | ||
| 5000 | ||
| 10000 |
Current price of 08-2513-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PLCC 20POS TIN
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 8POS GOLD
VNA TEST CABLE 3.5MM MALE TO 3.
IC FLASH 128MBIT PARALLEL 64FBGA
USB FLASH DRIVE 4GB USB 2.0