
| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 40 (1 x 40) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 | ||
| 100 | ||
| 500 | ||
| 1000 |
Current price of 40-0518-11 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
IC SOCKET, DIP, 32P 2.54MM PITCH
CONN IC DIP SOCKET 40POS GOLD
CONN IC DIP SOCKET 32POS GOLD
2.7" EPD, SPECTRA, W.ITC
CONN SOCKET SIP 40POS GOLD
IC MCU 32BIT 512KB FLASH 64VQFN
BOX ALUM GRAY 4.75"L X 4.75"W