
| Type | Description |
|---|---|
| Series: | 547 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SOIC, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 44 (2 x 22) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 |
Current price of 44-547-11E is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET LGA 2011POS GOLD
CONN IC DIP SOCKET 6POS GOLD
CONN IC DIP SOCKET 16POS GOLD
SFERNICE FIXED RESISTORS
CONN SOCKET SOIC ZIF 44POS GOLD
20 AWG 4C UNSHIELDED 100'
IC NVSRAM 1MBIT PAR 34PWRCAP