5P61006PGGI vs AB-557-03-HCLP-F-L-C-T3

This detailed comparison of 5P61006PGGI and AB-557-03-HCLP-F-L-C-T3 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

5P61006PGGI

5P61006PGGI

Renesas Electronics America

AB-557-03-HCLP-F-L-C-T3

AB-557-03-HCLP-F-L-C-T3

Abracon

Specifications
Manufacturer Renesas Electronics America Abracon
Package / Case 8-TSSOP (0.173", 4.40mm Width) 14-VFQFN Exposed Pad
Description IC BUFFER ZD DDR2/800 8-TSSOP IC PCIE CLOCK GEN 100MHZ 14QFN
In Stock 0 85 000
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - Pure Silicon™
Package Tube Tape & Reel (TR)
PLL Yes Yes
Main Purpose Memory, DDR2 PCI Express (PCIe), Clock Generator
Input Clock -
Output Clock HCSL, LVPECL
Number of Circuits 1 1
Ratio - Input:Output 1:1 0:2
Differential - Input:Output Yes/Yes No/Yes
Frequency - Max 425MHz 460MHz
Voltage - Supply 1.7V ~ 1.9V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 8-TSSOP 14-QFN (3.2x2.5)
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