932SQL420BGILFT vs DSC557-0333FI1T

This detailed comparison of 932SQL420BGILFT and DSC557-0333FI1T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

932SQL420BGILFT

932SQL420BGILFT

Renesas Electronics America

DSC557-0333FI1T

DSC557-0333FI1T

Roving Networks / Microchip Technology

Specifications
Manufacturer Renesas Electronics America Roving Networks / Microchip Technology
Package / Case 64-TFSOP (0.240", 6.10mm Width) 14-VFQFN Exposed Pad
Description TSSOP 17.00X6.10X1.00 MM, 0.50MM 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL
In Stock 89 000 145
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - DSC557-03
Package Tape & Reel (TR) Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
PLL Yes Yes
Main Purpose Intel CPU Servers PCI Express (PCIe)
Input Crystal -
Output HCSL HCSL, LVCMOS, LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:19 1:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 3.135V ~ 3.465V 2.25V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C
Supplier Device Package 64-TSSOP 14-QFN (2.5x3.2)
Top