9DB102BFLF vs DSC557-0333FL0

This detailed comparison of 9DB102BFLF and DSC557-0333FL0 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

9DB102BFLF

9DB102BFLF

Flip Electronics

DSC557-0333FL0

DSC557-0333FL0

Roving Networks / Microchip Technology

Specifications
Manufacturer Flip Electronics Roving Networks / Microchip Technology
Package / Case 20-SSOP (0.154", 3.90mm Width) 14-VFQFN Exposed Pad
Description IC BUFFER PCI EXPRESS 20-SSOP MEMS OSC XO 100.0000MHZ LVDS SMD
In Stock 85 000 177
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - DSC557-03
Package Bulk Tube
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input Clock -
Output HCSL LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:2 0:2
Differential - Input:Output Yes/Yes No/Yes
Frequency - Max 101MHz 100MHz
Voltage - Supply 3.135V ~ 3.465V 2.25V ~ 3.6V
Operating Temperature 0°C ~ 70°C -40°C ~ 105°C
Supplier Device Package 20-QSOP -
Top