9FGL6241AP301NDGI8 vs DSC557-0333FI1T

This detailed comparison of 9FGL6241AP301NDGI8 and DSC557-0333FI1T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

9FGL6241AP301NDGI8

9FGL6241AP301NDGI8

Renesas Electronics America

DSC557-0333FI1T

DSC557-0333FI1T

Roving Networks / Microchip Technology

Specifications
Manufacturer Renesas Electronics America Roving Networks / Microchip Technology
Package / Case 28-VFQFN Exposed Pad 14-VFQFN Exposed Pad
Description VFQFPN 4.00X4.00X0.90 MM, 0.40MM 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL
In Stock 87 000 145
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - DSC557-03
Package Tape & Reel (TR) Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input Clock -
Output LP-HCSL, LVCMOS HCSL, LVCMOS, LVDS
Number of Circuits 1 1
Ratio - Input:Output 3:2 1:2
Differential - Input:Output Yes/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 1.71V ~ 1.89V, 2.375V ~ 3.465V, 3.135V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C
Supplier Device Package 28-VFQFPN (4x4) 14-QFN (2.5x3.2)
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