This detailed comparison of A2F060M3E-FGG256 and A2F060M3E-FGG256I in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.
| Manufacturer | Microsemi | Microsemi |
|---|---|---|
| Package / Case | 256-LBGA | 256-LBGA |
| Description | IC SOC CORTEX-M3 80MHZ 256FBGA | IC SOC CORTEX-M3 80MHZ 256FBGA |
| In Stock | 45 000 | 89 000 |
| Mounting Type | - | - |
| Part Status | Obsolete | Obsolete |
| Series | SmartFusion® | SmartFusion® |
| Package | Tray | Tray |
| Architecture | MCU, FPGA | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 | ARM® Cortex®-M3 |
| Flash Size | 128KB | 128KB |
| RAM Size | 16KB | 16KB |
| Peripherals | DMA, POR, WDT | DMA, POR, WDT |
| Connectivity | EBI/EMI, I²C, SPI, UART/USART | EBI/EMI, I²C, SPI, UART/USART |
| Speed | 80MHz | 80MHz |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 256-FPBGA (17x17) | 256-FPBGA (17x17) |
