A2F200M3F-FGG484I vs A2F200M3F-FG484I

This detailed comparison of A2F200M3F-FGG484I and A2F200M3F-FG484I in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

A2F200M3F-FGG484I

Roving Networks / Microchip Technology

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A2F200M3F-FG484I

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	484-BGA	484-BGA
Description	IC SOC CORTEX-M3 80MHZ 484FBGA	IC SOC CORTEX-M3 80MHZ 484FBGA
In Stock	89 000	45 000
Mounting Type	-	-
Part Status	Active	Active
Series	SmartFusion®	SmartFusion®
Package	Tray	Tray
Architecture	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	256KB	256KB
RAM Size	64KB	64KB
Peripherals	DMA, POR, WDT	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed	80MHz	80MHz
Primary Attributes	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature	-40°C ~ 100°C (TJ)	-40°C ~ 100°C (TJ)
Supplier Device Package	484-FPBGA (23x23)	484-FPBGA (23x23)