A3P1000-2FGG256M vs EP2C8AF256A7N

This detailed comparison of A3P1000-2FGG256M and EP2C8AF256A7N in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

A3P1000-2FGG256M

Roving Networks / Microchip Technology

EP2C8AF256A7N

Intel

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Intel
Package / Case	256-LBGA	256-LBGA
Description	IC FPGA 177 I/O 256FBGA	IC FPGA 182 I/O 256FBGA
In Stock	89 000	809
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	ProASIC3	Cyclone® II
Package	Tray	Tray
Number of LABs/CLBs	-	516
Number of Logic Elements/Cells	-	8256
Total RAM Bits	147456	165888
Number of I/O	177	182
Number of Gates	1000000	-
Voltage - Supply	1.14V ~ 1.575V	1.15V ~ 1.25V
Operating Temperature	-55°C ~ 125°C (TJ)	-40°C ~ 125°C (TJ)
Supplier Device Package	256-FBGA (17x17)	256-FBGA (17x17)

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