ADBF702WCCPZ311 vs ADSP-BF702KCPZ-4

This detailed comparison of ADBF702WCCPZ311 and ADSP-BF702KCPZ-4 in the Embedded - DSP (Digital Signal Processors) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADBF702WCCPZ311

ADBF702WCCPZ311

Linear Technology (Analog Devices, Inc.)

ADSP-BF702KCPZ-4

ADSP-BF702KCPZ-4

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) Linear Technology (Analog Devices, Inc.)
Package / Case 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP
Description BLK+PROCW/256KBYTESRAM&DDR2 IC DSP LP 256KB L2SR 88LFCSP
In Stock 4 300 2 649
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Automotive Blackfin®
Package Tray Tray
Type Blackfin+ Blackfin+
Interface CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate 300MHz 400MHz
Non-Volatile Memory ROM (512kB) ROM (512kB)
On-Chip RAM 256kB 256kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.10V 1.10V
Operating Temperature -40°C ~ 105°C (TA) 0°C ~ 70°C (TA)
Supplier Device Package 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12)
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