ADG701LBRM-REEL7 vs NX3DV3899HRZ

This detailed comparison of ADG701LBRM-REEL7 and NX3DV3899HRZ in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADG701LBRM-REEL7

ADG701LBRM-REEL7

Linear Technology (Analog Devices, Inc.)

NX3DV3899HRZ

NX3DV3899HRZ

NXP Semiconductors

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) NXP Semiconductors
Package / Case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) 16-XFQFN Exposed Pad
Description IC SWITCH SPST 8MSOP IC ANLG SWITCH DPDT 16-HXQFN
In Stock 1 101 255
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - Automotive, AEC-Q100
Package Tape & Reel (TR) Tape & Reel (TR)
Switch Circuit SPST - NO DPDT
Multiplexer/Demultiplexer Circuit 1:1 2:2
Number of Circuits 1 2
On-State Resistance (Max) 3Ohm 3.3Ohm
Channel-to-Channel Matching (ΔRon) - 700mOhm
Voltage - Supply, Single (V+) 1.8V ~ 5V 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) - 1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max) 12ns, 8ns (Typ) 40ns, 20ns
-3db Bandwidth 200MHz 200MHz
Charge Injection 5pC 4pC
Channel Capacitance (CS(off), CD(off)) 17pF, 17pF 8pF
Current - Leakage (IS(off)) (Max) 250pA 5nA
Crosstalk - -90dB @ 1MHz
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 8-MSOP 16-HXQFNU (3x3)
Top