ADN8833ACPZ-R2 vs BM81810MUV-ME2

This detailed comparison of ADN8833ACPZ-R2 and BM81810MUV-ME2 in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADN8833ACPZ-R2

ADN8833ACPZ-R2

Linear Technology (Analog Devices, Inc.)

BM81810MUV-ME2

BM81810MUV-ME2

ROHM Semiconductor

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) ROHM Semiconductor
Package / Case 24-WFQFN Exposed Pad, CSP 32-VFQFN Exposed Pad
Description IC THERMO COOLER DRIVER 24LFCSP AUTOMOTIVE PANEL POWER MANAGEMEN
In Stock 91 6 980
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - Automotive, AEC-Q100
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Applications Thermoelectric Cooler Automotive, TFT-LCD Panels
Current - Supply 2.1mA 2mA
Voltage - Supply 2.7V ~ 5.5V 2.6V ~ 5.5V
Operating Temperature -40°C ~ 125°C -40°C ~ 105°C (TA)
Supplier Device Package 24-LFCSP-WQ (4x4) VQFN032V5050
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