ADSP-BF700BCPZ-2 vs ADBF700WCCPZ211

This detailed comparison of ADSP-BF700BCPZ-2 and ADBF700WCCPZ211 in the Embedded - DSP (Digital Signal Processors) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ADSP-BF700BCPZ-2

ADSP-BF700BCPZ-2

Linear Technology (Analog Devices, Inc.)

ADBF700WCCPZ211

ADBF700WCCPZ211

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer Linear Technology (Analog Devices, Inc.) Linear Technology (Analog Devices, Inc.)
Package / Case 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP
Description IC DSP LP 128KB L2SR 88LFCSP BLACKFIN+ W/ 128K L2 SRAM
In Stock 2 000 119
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Blackfin® Automotive
Package Tray Tray
Type Blackfin+ Blackfin+
Interface CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate 200MHz 200MHz
Non-Volatile Memory ROM (512kB) ROM (512kB)
On-Chip RAM 128kB 128kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.10V 1.10V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12)
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