AGLE3000V5-FG896I vs EP2C70F896I8

This detailed comparison of AGLE3000V5-FG896I and EP2C70F896I8 in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

AGLE3000V5-FG896I

AGLE3000V5-FG896I

Microsemi

EP2C70F896I8

EP2C70F896I8

Intel

Specifications
Manufacturer Microsemi Intel
Package / Case 896-BGA 896-BGA
Description IC FPGA 620 I/O 896FBGA IC FPGA 622 I/O 896FBGA
In Stock 2 964 370
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series IGLOOe Cyclone® II
Package Tray Tray
Number of LABs/CLBs - 4276
Number of Logic Elements/Cells 75264 68416
Total RAM Bits 516096 1152000
Number of I/O 620 622
Number of Gates 3000000 -
Voltage - Supply 1.425V ~ 1.575V 1.15V ~ 1.25V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 100°C (TJ)
Supplier Device Package 896-FBGA (31x31) 896-FBGA (31x31)
Part Number Manufacturer Description Request For Quote
5SGXMA3K3F40I3WN Intel IC FPGA STRATIX V GX FLIP CHIP
EP2AGX260FF35I3NGA Intel IC FPGA 612 I/O 1152FBGA
A3P600L-FGG256I Microsemi IC FPGA 177 I/O 256FBGA
M1AGL600V2-FGG484I Microsemi IC FPGA 235 I/O 484FBGA
5AGXBB1D4F35C4NAA Intel IC FPGA 544 I/O 1152FBGA
XCV100-5PQ240C Xilinx IC FPGA 166 I/O 240QFP
XCV200E-7BG352I Xilinx IC FPGA 260 I/O 352MBGA
A3P250L-PQ208 Microsemi IC FPGA 151 I/O 208QFP
XC4013E-2PG223C Xilinx IC FPGA 192 I/O 223CPGA
XC4036XL-2HQ240I Xilinx IC FPGA 193 I/O 240QFP
XC4008E-3PQ160I Xilinx IC FPGA 129 I/O 160QFP
A1415A-1PLG84C Microsemi IC FPGA 70 I/O 84PLCC
EP3SL200F1152I3NAA Intel IC FPGA STRATIX III FLIP CHIP
EP2SGX90EF1152C4G Intel IC FPGA 558 I/O 1152FBGA
XCV400E-7BG560I Xilinx IC FPGA 404 I/O 560MBGA
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