BD8157EFV-E2 vs MAX20012ATJB/V+T

This detailed comparison of BD8157EFV-E2 and MAX20012ATJB/V+T in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BD8157EFV-E2

ROHM Semiconductor

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MAX20012ATJB/V+T

Maxim Integrated

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Specifications Hide identical items

Manufacturer	ROHM Semiconductor	Maxim Integrated
Package / Case	20-VSSOP (0.173", 4.40mm Width) Exposed Pad	32-WFQFN Exposed Pad
Description	IC POWER SUP 1-CH HTSSOP-B20	IC REG BUCK
In Stock	8 414	1 574
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	-	Automotive, AEC-Q100
Package	Tape & Reel (TR)	Tape & Reel (TR)
Applications	TFT-LCD Panels: Gamma Buffer, VCOM Driver	Automotive
Current - Supply	1.2mA	1.1mA
Voltage - Supply	2.1V ~ 4V	3V ~ 5.5V
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C (TA)
Supplier Device Package	20-HTSSOP-B	32-TQFN (5x5)