BM81810MUV-ME2 vs ADN8833ACPZ-R2

This detailed comparison of BM81810MUV-ME2 and ADN8833ACPZ-R2 in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BM81810MUV-ME2

BM81810MUV-ME2

ROHM Semiconductor

ADN8833ACPZ-R2

ADN8833ACPZ-R2

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer ROHM Semiconductor Linear Technology (Analog Devices, Inc.)
Package / Case 32-VFQFN Exposed Pad 24-WFQFN Exposed Pad, CSP
Description AUTOMOTIVE PANEL POWER MANAGEMEN IC THERMO COOLER DRIVER 24LFCSP
In Stock 6 980 91
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Automotive, AEC-Q100 -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Applications Automotive, TFT-LCD Panels Thermoelectric Cooler
Current - Supply 2mA 2.1mA
Voltage - Supply 2.6V ~ 5.5V 2.7V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 125°C
Supplier Device Package VQFN032V5050 24-LFCSP-WQ (4x4)
Top