BU3076HFV-TR vs MC88916EG70R2

This detailed comparison of BU3076HFV-TR and MC88916EG70R2 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

BU3076HFV-TR

BU3076HFV-TR

ROHM Semiconductor

MC88916EG70R2

MC88916EG70R2

Renesas Electronics America

Specifications
Manufacturer ROHM Semiconductor Renesas Electronics America
Package / Case 6-SMD, Flat Lead Exposed Pad 20-SOIC (0.295", 7.50mm Width)
Description IC CLOCK GEN 1CH HVSOF6 IC CLK BUF CISC 70MHZ 1CIRC
In Stock 1 614 6 997
Mounting Type Surface Mount Surface Mount
Part Status Not For New Designs Active
Series - -
Package Tape & Reel (TR) Tape & Reel (TR)
PLL Yes Yes
Main Purpose Digital Cameras CISC/RISC Microprocessor
Input Clock CMOS, TTL
Output Clock CMOS
Number of Circuits 1 1
Ratio - Input:Output 1:1 1:6
Differential - Input:Output No/No No/Yes
Frequency - Max 67.5MHz 70MHz
Voltage - Supply 2.85V ~ 3.6V 4.5V ~ 5.5V
Operating Temperature -5°C ~ 75°C -40°C ~ 85°C
Supplier Device Package 6-HVSOF 20-SOIC
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