C8051T630-GDI vs C8051F330-GDI

This detailed comparison of C8051T630-GDI and C8051F330-GDI in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

C8051T630-GDI

Silicon Labs

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C8051F330-GDI

Silicon Labs

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Specifications Hide identical items

Manufacturer	Silicon Labs	Silicon Labs
Package / Case	Die	Die
Description	IC MCU 8BIT 8KB OTP DIE	IC MCU 8BIT 8KB FLASH DIE
In Stock	5 282	9 032
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	C8051T63x	C8051F33x
Package	Bulk	Bulk
Core Processor	8051	8051
Core Size	8-Bit	8-Bit
Speed	25MHz	25MHz
Connectivity	SMBus (2-Wire/I²C), SPI, UART/USART	SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals	POR, PWM, Temp Sensor, WDT	POR, PWM, Temp Sensor, WDT
Number of I/O	17	17
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	OTP	FLASH
EEPROM Size	-	-
RAM Size	768 x 8	768 x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 16x10b; D/A 1x10b	A/D 16x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	-