CDCD5704PWRG4 vs MAX3637ETM2

This detailed comparison of CDCD5704PWRG4 and MAX3637ETM2 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CDCD5704PWRG4

CDCD5704PWRG4

Texas Instruments

MAX3637ETM2

MAX3637ETM2

Roving Networks / Microchip Technology

Specifications
Manufacturer Texas Instruments Roving Networks / Microchip Technology
Package / Case 28-TSSOP (0.173", 4.40mm Width) 48-WFQFN Exposed Pad
Description IC CLOCK GEN FOR XDR MEM 28TSSOP IC PLL CLOCK GEN LO JITT 48TQFN
In Stock 1 063 3 139
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series - -
Package Tape & Reel (TR) Tray
PLL Yes Yes
Main Purpose Memory, RDRAM; Extreme Data Rate (XDR™) Ethernet, Fibre Channel, SONET/SDH
Input Clock LVCMOS, LVTTL, Crystal
Output Clock LVCMOS, LVDS, LVPECL
Number of Circuits 1 1
Ratio - Input:Output 1:4 3:10
Differential - Input:Output Yes/Yes Yes/Yes
Frequency - Max 800MHz 800MHz
Voltage - Supply 2.375V ~ 2.625V 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package 28-TSSOP 48-TQFN (7x7)
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