CY2310ANZPVXI-1 vs DSC557-0344FL1

This detailed comparison of CY2310ANZPVXI-1 and DSC557-0344FL1 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY2310ANZPVXI-1

CY2310ANZPVXI-1

Cypress Semiconductor

DSC557-0344FL1

DSC557-0344FL1

Roving Networks / Microchip Technology

Specifications
Manufacturer Cypress Semiconductor Roving Networks / Microchip Technology
Package / Case 28-SSOP (0.209", 5.30mm Width) 14-VFQFN Exposed Pad
Description IC CLK BUFF 10OUT SDRAM 28SSOP MEMS OSC XO 100.0000MHZ HCSL SMD
In Stock 3 483 870
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - DSC557-03
Package Tube Tube
PLL No Yes
Main Purpose Intel CPU, SRAM SO-DIMMs PCI Express (PCIe)
Input LVCMOS, LVTTL -
Output LVCMOS HCSL
Number of Circuits 1 1
Ratio - Input:Output 1:10 0:2
Differential - Input:Output No/No No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 3.135V ~ 3.465V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 105°C
Supplier Device Package 28-SSOP 14-QFN (2.5x3.2)
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