CY2318ANZPVXC-11T vs DSC557-0334SI1

This detailed comparison of CY2318ANZPVXC-11T and DSC557-0334SI1 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY2318ANZPVXC-11T

CY2318ANZPVXC-11T

Cypress Semiconductor

DSC557-0334SI1

DSC557-0334SI1

Roving Networks / Microchip Technology

Specifications
Manufacturer Cypress Semiconductor Roving Networks / Microchip Technology
Package / Case 48-BSSOP (0.295", 7.50mm Width) 14-VFQFN Exposed Pad
Description IC CLK BUFF 18OUT SDRAM 48SSOP MEMS OSC XO 100.0000MHZ HCSL LVD
In Stock 1 374 505
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - DSC557-03
Package Tape & Reel (TR) Tube
PLL No Yes
Main Purpose Intel CPU, Memory, SRAM DIMM PCI Express (PCIe)
Input LVCMOS, LVTTL -
Output LVCMOS HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:18 0:2
Differential - Input:Output No/No No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 3.135V ~ 3.465V 2.25V ~ 3.6V
Operating Temperature 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package 48-SSOP -
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