CY8C6117FDI-F02T vs CY8C6137FDI-F02T

This detailed comparison of CY8C6117FDI-F02T and CY8C6137FDI-F02T in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

CY8C6117FDI-F02T

Cypress Semiconductor

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CY8C6137FDI-F02T

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	80-XFBGA, WLCSP	80-XFBGA, WLCSP
Description	IC MCU 32BIT 1MB FLASH 80WLCSP	IC MCU 32BIT 1MB FLASH 80WLCSP
In Stock	6 619	1 090
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PSoC® 6	PSoC® 6
Package	Tape & Reel (TR)	Tape & Reel (TR)
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	50MHz	150MHz
Connectivity	I²C, LINbus, QSPI, SPI, UART/USART, USB	I²C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, CapSense, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, CapSense, DMA, I²S, POR, PWM, WDT
Number of I/O	62	62
Program Memory Size	1MB (1M x 8)	1MB (1M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8
RAM Size	288K x 8	288K x 8
Voltage - Supply (Vcc/Vdd)	1.7V ~ 3.6V	1.7V ~ 3.6V
Data Converters	A/D 16x12b SAR; D/A 2x7b, 1x12b	A/D 16x12b SAR; D/A 2x7b, 1x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	80-WLCSP (3.68x3.19)	80-WLCSP (3.68x3.19)