D17760BP200ADV vs HD6417760BL200AV

This detailed comparison of D17760BP200ADV and HD6417760BL200AV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

D17760BP200ADV

Renesas Electronics America

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HD6417760BL200AV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	256-LFBGA	256-LFBGA
Description	IC MCU 32BIT ROMLESS 256LFBGA	IC MCU 32BIT ROMLESS 256LFBGA
In Stock	2 000	185
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SuperH® SH7750	SuperH® SH7750
Package	Tray	Tray
Core Processor	SH-4	SH-4
Core Size	32-Bit	32-Bit
Speed	200MHz	200MHz
Connectivity	Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB	Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals	DMA, LCD, POR, WDT	DMA, LCD, POR, WDT
Number of I/O	69	69
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	48K x 8	48K x 8
Voltage - Supply (Vcc/Vdd)	1.4V ~ 1.6V	1.4V ~ 1.6V
Data Converters	A/D 4x10b	A/D 4x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	256-LFBGA (17x17)	256-LFBGA (17x17)