DF2317VTEBL25V vs DF2317VTE25V

This detailed comparison of DF2317VTEBL25V and DF2317VTE25V in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF2317VTEBL25V

Renesas Electronics America

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DF2317VTE25V

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-TQFP	100-TQFP
Description	IC MCU 16BIT 128KB FLASH 100TQFP	IC MCU 16BIT 128KB FLASH 100TQFP
In Stock	500	640
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	H8® H8S/2300	H8® H8S/2300
Package	Tray	Tray
Core Processor	H8S/2000	H8S/2000
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Connectivity	SCI, SmartCard	SCI, SmartCard
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	70	70
Program Memory Size	128KB (128K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 8x10b; D/A 2x8b	A/D 8x10b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-20°C ~ 75°C (TA)	-20°C ~ 75°C (TA)
Supplier Device Package	100-TQFP (14x14)	100-TQFP (14x14)