DF38324WWV vs HD6473827RWV

This detailed comparison of DF38324WWV and HD6473827RWV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF38324WWV

Renesas Electronics America

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HD6473827RWV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	80-TQFP	80-TQFP
Description	IC MCU 8BIT 32KB FLASH 80TQFP	IC MCU 8BIT 60KB OTP 80TQFP
In Stock	269	959
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Obsolete
Series	H8® H8/300L SLP	H8® H8/300L SLP
Package	Tray	Tray
Core Processor	H8/300L	H8/300L
Core Size	8-Bit	8-Bit
Speed	8MHz	8MHz
Connectivity	SCI	SCI
Peripherals	LCD, PWM, WDT	LCD, PWM, WDT
Number of I/O	55	55
Program Memory Size	32KB (32K x 8)	60KB (60K x 8)
Program Memory Type	FLASH	OTP
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	1.8V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-20°C ~ 75°C (TA)
Supplier Device Package	80-TQFP (12x12)	80-TQFP (12x12)