DG1208EUE+ vs NX3DV3899HRZ

This detailed comparison of DG1208EUE+ and NX3DV3899HRZ in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DG1208EUE+

DG1208EUE+

Maxim Integrated

NX3DV3899HRZ

NX3DV3899HRZ

NXP Semiconductors

Specifications
Manufacturer Maxim Integrated NXP Semiconductors
Package / Case 16-TSSOP (0.173", 4.40mm Width) 16-XFQFN Exposed Pad
Description LOW LEAKAGE, HIGH VOLTAGE 8:1 MU IC ANLG SWITCH DPDT 16-HXQFN
In Stock 805 255
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - Automotive, AEC-Q100
Package Tube Tape & Reel (TR)
Switch Circuit - DPDT
Multiplexer/Demultiplexer Circuit 8:1 2:2
Number of Circuits 1 2
On-State Resistance (Max) 160Ohm 3.3Ohm
Channel-to-Channel Matching (ΔRon) 30Ohm 700mOhm
Voltage - Supply, Single (V+) 5V ~ 20V 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) 5V ~ 20V 1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max) 400ns, 400ns 40ns, 20ns
-3db Bandwidth 200MHz 200MHz
Charge Injection 0.5pC 4pC
Channel Capacitance (CS(off), CD(off)) 15pF, 10pF 8pF
Current - Leakage (IS(off)) (Max) 30µA 5nA
Crosstalk -80dB @ 1MHz -90dB @ 1MHz
Operating Temperature -40°C ~ 85°C -40°C ~ 125°C (TA)
Supplier Device Package 16-TSSOP 16-HXQFNU (3x3)
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