DSC557-0333SE1T vs DSC557-054444KE0

This detailed comparison of DSC557-0333SE1T and DSC557-054444KE0 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0333SE1T

DSC557-0333SE1T

Roving Networks / Microchip Technology

DSC557-054444KE0

DSC557-054444KE0

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 16-TSSOP (0.173", 4.40mm Width) 20-VFQFN Exposed Pad
Description MEMS OSC XO 100.0000MHZ LVDS SMD MEMS OSC XO 100.0000MHZ HCSL SMD
In Stock 275 919
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 DSC557-05
Package Tape & Reel (TR) Tube
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - -
Output LVDS HCSL
Number of Circuits 1 1
Ratio - Input:Output 0:2 0:4
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 2.25V ~ 3.6V
Operating Temperature -20°C ~ 70°C -20°C ~ 70°C
Supplier Device Package - -
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