DSC557-0334FI1T vs DSC557-0343SI0T

This detailed comparison of DSC557-0334FI1T and DSC557-0343SI0T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0334FI1T

DSC557-0334FI1T

Roving Networks / Microchip Technology

DSC557-0343SI0T

DSC557-0343SI0T

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 14-VFQFN Exposed Pad 16-TSSOP (0.173", 4.40mm Width)
Description MEMS OSC XO 100.0000MHZ HCSL LVD MEMS OSC XO 100.0000MHZ HCSL LVD
In Stock 248 598
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series DSC557-03 DSC557-03
Package Tape & Reel (TR) Tape & Reel (TR)
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - -
Output HCSL, LVDS HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 0:2 0:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package - -
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