DSC557-0334FI1 vs SI52112-B6-GM2

This detailed comparison of DSC557-0334FI1 and SI52112-B6-GM2 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0334FI1

DSC557-0334FI1

Roving Networks / Microchip Technology

SI52112-B6-GM2

SI52112-B6-GM2

Silicon Labs

Specifications
Manufacturer Roving Networks / Microchip Technology Silicon Labs
Package / Case 14-VFQFN Exposed Pad 10-WFDFN Exposed Pad
Description MEMS OSC XO 100.0000MHZ HCSL LVD IC OSC PCI EXPRESS 2OUTPUT
In Stock 388 71
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 -
Package Tube Strip
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - Clock, Crystal
Output HCSL, LVDS HCSL
Number of Circuits 1 1
Ratio - Input:Output 0:2 1:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 2.97V ~ 3.63V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package - 10-TDFN (3x3)
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