DSC557-0334SI1 vs 9FGL6241AP301NDGI

This detailed comparison of DSC557-0334SI1 and 9FGL6241AP301NDGI in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0334SI1

DSC557-0334SI1

Roving Networks / Microchip Technology

9FGL6241AP301NDGI

9FGL6241AP301NDGI

Renesas Electronics America

Specifications
Manufacturer Roving Networks / Microchip Technology Renesas Electronics America
Package / Case 14-VFQFN Exposed Pad 28-VFQFN Exposed Pad
Description MEMS OSC XO 100.0000MHZ HCSL LVD VFQFPN 4.00X4.00X0.90 MM, 0.40MM
In Stock 505 87 000
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 -
Package Tube Tray
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - Clock
Output HCSL, LVDS LP-HCSL, LVCMOS
Number of Circuits 1 1
Ratio - Input:Output 0:2 3:2
Differential - Input:Output No/Yes Yes/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 1.71V ~ 1.89V, 2.375V ~ 3.465V, 3.135V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA)
Supplier Device Package - 28-VFQFPN (4x4)
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