DSC557-0341FE1 vs 557MI-01LFT

This detailed comparison of DSC557-0341FE1 and 557MI-01LFT in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0341FE1

DSC557-0341FE1

Roving Networks / Microchip Technology

557MI-01LFT

557MI-01LFT

Renesas Electronics America

Specifications
Manufacturer Roving Networks / Microchip Technology Renesas Electronics America
Package / Case 14-VFQFN Exposed Pad 8-SOIC (0.154", 3.90mm Width)
Description MEMS OSC XO 100.0000MHZ HCSL LVC IC CLK SOURCE PCI EXPRESS 8-SOIC
In Stock 422 0
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series DSC557-03 -
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - Clock, Crystal
Output HCSL, LVCMOS HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 0:2 1:1
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 3.135V ~ 3.465V
Operating Temperature -20°C ~ 70°C -40°C ~ 85°C
Supplier Device Package 14-QFN (2.5x3.2) 8-SOIC
Top