DSC557-0343FI1 vs ZL30110LDF1

This detailed comparison of DSC557-0343FI1 and ZL30110LDF1 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0343FI1

DSC557-0343FI1

Roving Networks / Microchip Technology

ZL30110LDF1

ZL30110LDF1

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 14-VFQFN Exposed Pad 32-VFQFN Exposed Pad
Description MEMS OSC XO 100.0000MHZ HCSL LVD IC DPLL RATE CONVERSION 32QFN
In Stock 856 1 931
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 -
Package Tube Tape & Reel (TR)
PLL Yes Yes
Main Purpose PCI Express (PCIe) Telecom
Input - LVCMOS, Crystal
Output HCSL, LVDS LVCMOS
Number of Circuits 1 1
Ratio - Input:Output 0:2 2:4
Differential - Input:Output No/Yes No/No
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 3.1V ~ 3.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 14-QFN (2.5x3.2) 32-QFN (5x5)
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