DSC557-0343SI1T vs CY2310ANZPVXI-1

This detailed comparison of DSC557-0343SI1T and CY2310ANZPVXI-1 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0343SI1T

DSC557-0343SI1T

Roving Networks / Microchip Technology

CY2310ANZPVXI-1

CY2310ANZPVXI-1

Cypress Semiconductor

Specifications
Manufacturer Roving Networks / Microchip Technology Cypress Semiconductor
Package / Case 16-TSSOP (0.173", 4.40mm Width) 28-SSOP (0.209", 5.30mm Width)
Description MEMS OSC XO 100.0000MHZ HCSL LVD IC CLK BUFF 10OUT SDRAM 28SSOP
In Stock 920 3 483
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series DSC557-03 -
Package Tape & Reel (TR) Tube
PLL Yes No
Main Purpose PCI Express (PCIe) Intel CPU, SRAM SO-DIMMs
Input - LVCMOS, LVTTL
Output HCSL, LVDS LVCMOS
Number of Circuits 1 1
Ratio - Input:Output 0:2 1:10
Differential - Input:Output No/Yes No/No
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 3.135V ~ 3.465V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package - 28-SSOP
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