DSC557-0343SI1 vs DSC557-0333FI0

This detailed comparison of DSC557-0343SI1 and DSC557-0333FI0 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0343SI1

DSC557-0343SI1

Roving Networks / Microchip Technology

DSC557-0333FI0

DSC557-0333FI0

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 16-TSSOP (0.173", 4.40mm Width) 14-VFQFN Exposed Pad
Description MEMS OSC XO 100.0000MHZ HCSL LVD MEMS OSC XO 100.0000MHZ LVDS SMD
In Stock 710 141
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 DSC557-03
Package Tube Tube
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - -
Output HCSL, LVDS LVDS
Number of Circuits 1 1
Ratio - Input:Output 0:2 0:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package - -
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