DSC557-0344FI0 vs MC88916EG80R2

This detailed comparison of DSC557-0344FI0 and MC88916EG80R2 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0344FI0

DSC557-0344FI0

Roving Networks / Microchip Technology

MC88916EG80R2

MC88916EG80R2

Renesas Electronics America

Specifications
Manufacturer Roving Networks / Microchip Technology Renesas Electronics America
Package / Case 14-VFQFN Exposed Pad 20-SOIC (0.295", 7.50mm Width)
Description MEMS OSC XO 100.0000MHZ HCSL SMD IC CLK BUF CISC 80MHZ 1CIRC
In Stock 465 4 500
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 -
Package Tube Tape & Reel (TR)
PLL Yes Yes
Main Purpose PCI Express (PCIe) CISC/RISC Microprocessor
Input - CMOS, TTL
Output HCSL CMOS
Number of Circuits 1 1
Ratio - Input:Output 0:2 1:6
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 80MHz
Voltage - Supply 2.25V ~ 3.6V 4.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 14-QFN (2.5x3.2) 20-SOIC
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