DSC557-0344SE1T vs CY24292LFXIT

This detailed comparison of DSC557-0344SE1T and CY24292LFXIT in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0344SE1T

DSC557-0344SE1T

Roving Networks / Microchip Technology

CY24292LFXIT

CY24292LFXIT

Cypress Semiconductor

Specifications
Manufacturer Roving Networks / Microchip Technology Cypress Semiconductor
Package / Case 16-TSSOP (0.173", 4.40mm Width) 32-UFQFN Exposed Pad
Description MEMS OSC XO 100.0000MHZ HCSL LVD IC CLOCK BUFFER 32QFN
In Stock 275 1 721
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series DSC557-03 -
Package Tape & Reel (TR) Tape & Reel (TR)
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - LVCMOS, LVTTL, Crystal
Output HCSL, LVDS HCSL, LVCMOS, LVDS
Number of Circuits 1 1
Ratio - Input:Output 0:2 1:5
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 3V ~ 3.6V
Operating Temperature -20°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 32-QFN (5x5)
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