DSC557-0344SE1 vs DSC557-0344SE1T

This detailed comparison of DSC557-0344SE1 and DSC557-0344SE1T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSC557-0344SE1

DSC557-0344SE1

Roving Networks / Microchip Technology

DSC557-0344SE1T

DSC557-0344SE1T

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width)
Description MEMS OSC XO 100.0000MHZ HCSL LVD MEMS OSC XO 100.0000MHZ HCSL LVD
In Stock 440 275
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series DSC557-03 DSC557-03
Package Tube Tape & Reel (TR)
PLL Yes Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input - -
Output HCSL, LVDS HCSL, LVDS
Number of Circuits 1 1
Ratio - Input:Output 0:2 0:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.6V 2.25V ~ 3.6V
Operating Temperature -20°C ~ 70°C -20°C ~ 70°C
Supplier Device Package - -
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