DSPIC33EP256GM310-H/BG vs DSPIC33EP256GM310-I/BG

This detailed comparison of DSPIC33EP256GM310-H/BG and DSPIC33EP256GM310-I/BG in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256GM310-H/BG

DSPIC33EP256GM310-H/BG

Roving Networks / Microchip Technology

DSPIC33EP256GM310-I/BG

DSPIC33EP256GM310-I/BG

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 121-TFBGA 121-TFBGA
Description IC MCU 16BIT 256KB FLSH 121TFBGA IC MCU 16BIT 256KB FLSH 121TFBGA
In Stock 136 803
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Automotive, AEC-Q100, dsPIC™ 33EP dsPIC™ 33EP
Package Tray Tray
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed - 70 MIPs
Connectivity I²C, IrDA, LINbus, QEI, SPI, UART/USART I²C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 85 85
Program Memory Size 256KB (85.5K x 24) 256KB (85.5K x 24)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) - 3V ~ 3.6V
Data Converters A/D 49x10b/12b A/D 49x10b/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 150°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 121-TFBGA (10x10) 121-TFBGA (10x10)
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