DSPIC33EP256MU810-I/BG vs DSPIC33EP256MU810T-E/BG

This detailed comparison of DSPIC33EP256MU810-I/BG and DSPIC33EP256MU810T-E/BG in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP256MU810-I/BG

Roving Networks / Microchip Technology

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DSPIC33EP256MU810T-E/BG

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	121-TFBGA	121-TFBGA
Description	IC MCU 16BIT 256KB FLSH 121TFBGA	IC MCU 16BIT 256KB FLSH 121TFBGA
In Stock	892	425
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Obsolete
Series	dsPIC™ 33EP	Automotive, AEC-Q100, dsPIC™ 33EP
Package	Tray	Tape & Reel (TR)
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	60 MIPs	60 MIPs
Connectivity	CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG	CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O	83	83
Program Memory Size	256KB (85.5K x 24)	256KB (85.5K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	12K x 16	12K x 16
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 32x10b/12b	A/D 32x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	121-TFBGA (10x10)	121-TFBGA (10x10)