DSPIC33EP512GM306T-I/MR vs DSPIC33EP512GM306-H/MR

This detailed comparison of DSPIC33EP512GM306T-I/MR and DSPIC33EP512GM306-H/MR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP512GM306T-I/MR

DSPIC33EP512GM306T-I/MR

Roving Networks / Microchip Technology

DSPIC33EP512GM306-H/MR

DSPIC33EP512GM306-H/MR

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Description IC MCU 16BIT 512KB FLASH 64VQFN IC MCU 16BIT 512KB FLASH 64VQFN
In Stock 234 500
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series dsPIC™ 33EP Automotive, AEC-Q100, dsPIC™ 33EP
Package Tape & Reel (TR) Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 70 MIPs -
Connectivity I²C, IrDA, LINbus, QEI, SPI, UART/USART I²C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 53 53
Program Memory Size 512KB (170K x 24) 512KB (170K x 24)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 48K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) - -
Data Converters A/D 30x10b/12b A/D 30x10b/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 150°C (TA)
Supplier Device Package 64-VQFN (9x9) 64-VQFN (9x9)
Part Number Manufacturer Description Request For Quote
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