DSPIC33EP64GP506-E/MR vs DSPIC33EP64GP506-I/MR

This detailed comparison of DSPIC33EP64GP506-E/MR and DSPIC33EP64GP506-I/MR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33EP64GP506-E/MR

Roving Networks / Microchip Technology

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DSPIC33EP64GP506-I/MR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 16BIT 64KB FLASH 64VQFN	IC MCU 16BIT 64KB FLASH 64VQFN
In Stock	317	157
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Automotive, AEC-Q100, dsPIC™ 33EP	dsPIC™ 33EP
Package	Tube	Tube
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	60 MIPs	70 MIPs
Connectivity	CANbus, I²C, IrDA, LINbus, SPI, UART/USART	CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	53	53
Program Memory Size	64KB (22K x 24)	64KB (22K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	4K x 16	4K x 16
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 16x10b/12b	A/D 16x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-VQFN (9x9)	64-VQFN (9x9)