DSPIC33FJ09GS302-I/MM vs DSPIC33FJ09GS302T-I/MM

This detailed comparison of DSPIC33FJ09GS302-I/MM and DSPIC33FJ09GS302T-I/MM in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33FJ09GS302-I/MM

Roving Networks / Microchip Technology

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DSPIC33FJ09GS302T-I/MM

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-VQFN Exposed Pad	28-VQFN Exposed Pad
Description	IC MCU 16BIT 9KB FLASH 28QFN	IC MCU 16BIT 9KB FLASH 28QFN
In Stock	233	132
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	dsPIC™ 33F	dsPIC™ 33F
Package	Tube	Tape & Reel (TR)
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	40 MIPs	40 MIPs
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	21	21
Program Memory Size	9KB (3K x 24)	9KB (3K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 8x10b; D/A 2x10b	A/D 8x10b; D/A 2x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-QFN-S (6x6)	28-QFN-S (6x6)