DSPIC33FJ32GS606-I/PT vs DSPIC33FJ32GS606T-I/PT

This detailed comparison of DSPIC33FJ32GS606-I/PT and DSPIC33FJ32GS606T-I/PT in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33FJ32GS606-I/PT

Roving Networks / Microchip Technology

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DSPIC33FJ32GS606T-I/PT

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-TQFP	64-TQFP
Description	IC MCU 16BIT 32KB FLASH 64TQFP	IC MCU 16BIT 32KB FLASH 64TQFP
In Stock	184	233
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	dsPIC™ 33F	dsPIC™ 33F
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	40 MIPs	40 MIPs
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, QEI, POR, PWM, WDT	Brown-out Detect/Reset, QEI, POR, PWM, WDT
Number of I/O	58	58
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	4K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 16x10b; D/A 1x10b	A/D 16x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-TQFP (10x10)	64-TQFP (10x10)